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Comparative depths of cure among various curing light types and methods.

机译:各种固化灯类型和方法之间的比较固化深度。

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This study evaluated the depth of cure associated with commercial LEDs (light-emitting diodes) (Elipar FreeLight [FL], 3M-ESPE; GC e-Light [EL], GC), high intensity (Elipar TriLight [TL], 3M-ESPE) and very high intensity (Astralis 10 [AS], Ivoclar Vivadent) Quartz Tungsten Halogen (QTH) curing lights. Depth of cure of the various lights/curing modes were compared to a conventional QTH light (Max [Mx], Dentsply-Caulk). Ten exposure regimens were investigated: FL1 - 400 mW/cm2 [40 seconds]; FL2 - 0-400 mW/cm2 [12 seconds] --> 400 mW/cm2 [28 seconds]; EL1 - 750 mW/cm2 [10 pulses x 2 seconds], EL2 - 350 mW/cm2 [40 seconds]; EL3 - 600 mW/cm2 [20 seconds]; EL4 - 0 - 600 mW/cm2 [20 seconds] --> 600 mW/cm2 [20 seconds]; TL1 - 800 mW/cm2 [40 seconds]; TL2 - 100- 800 mW/cm2 [15 seconds] --> 800 mW/cm2 [25 seconds]; AS1 - 1200 mW/cm2 [10 seconds]; MX - 400 mW/cm2 [40 seconds]. Depth of cure was determined by penetration, scraping and microhardness techniques. The results were analyzed using one-way ANOVA/Scheffe's post-hoc test and Pearson's correlation at significance level 0.05 and 0.01, respectively. All light curing regimens met the ISO depth of cure requirement of 1.5 mm with the exception of EL1-EL3 with the microhardness technique. Curing with most modes of EL resulted in significantly lower depths of cure than the control [MX]. No significant difference in depth of cure was observed among the control and the two modes of FL. Curing with TL1 resulted in significantly greater depth of cure compared to MX with all testing techniques. No significant difference in depth of cure was observed between the control and AS1 for all testing techniques except for the penetration technique. The depth of composite cure is light unit and exposure mode dependent. Scraping and penetration techniques were found to correlate well but tend to overestimate depth of cure compared to microhardness.
机译:这项研究评估了与商用LED(发光二极管)(Elipar FreeLight [FL],3M-ESPE; GC e-Light [EL],GC),高强度(Elipar TriLight [TL],3M- ESPE)和非常高的强度(Astralis 10 [AS],Ivoclar Vivadent)石英钨卤素灯(QTH)固化灯。将各种光/固化模式的固化深度与常规QTH光(Max [Mx],Dentsply-Caulk)进行了比较。研究了十种暴露方案:FL1-400 mW / cm2 [40秒]; FL2-0-400 mW / cm2 [12秒]-> 400 mW / cm2 [28秒]; EL1-750 mW / cm2 [10脉冲x 2秒],EL2- 350 mW / cm2 [40秒]; EL3-600 mW / cm2 [20秒]; EL4-0-600 mW / cm2 [20秒]-> 600 mW / cm2 [20秒]; TL1-800 mW / cm2 [40秒]; TL2-100- 800 mW / cm2 [15秒]-> 800 mW / cm2 [25秒]; AS1-1200 mW / cm2 [10秒]; MX-400 mW / cm2 [40秒]。固化深度由渗透,刮擦和显微硬度技术确定。使用单因素方差分析/ Scheffe事后检验和Pearson相关性分别在显着性水平0.05和0.01处分析结果。除采用显微硬度技术的EL1-EL3外,所有光固化方案均满足1.5 mm的ISO固化深度要求。使用大多数模式的EL进行固化所产生的固化深度明显低于对比例[MX]。在对照和两种FL模式之间,未观察到固化深度的显着差异。与所有测试技术的MX相比,使用TL1进行固化可显着提高固化深度。除渗透技术外,对于所有测试技术,对照组和AS1的固化深度均未见明显差异。复合固化的深度取决于光单位和曝光模式。发现刮擦和渗透技术具有很好的相关性,但与显微硬度相比,往往会高估固化深度。

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