PLASMA TECHNOLOGY FOR PROCESSING OF WASTE PRINTED CIRCUIT BOARDS FOR METALS RECOVERY

摘要

Paper describes empirical verification of plasma technology for processing of waste printed circuit boards (PCB) for metals recovery and waste neutralization. Test setup was designed and build, allowing experiments over plasma processing of PCB waste in scale of 800 kg of waste per day. Designed and tested setup proved functionality of such small scale operation. The process in tests consumed in total 66 kW of power, which relates to 2 kWh/kg of processed PCB waste. Presented in the paper research covers examination of power consumption during waste processing heat parameters, potential of heat recovery, mass reduction, amount of recovered metals and identification of variables influencing lowering metals recovery and increasing slag mass. Also brief analysis of process products and slag sample composition is presented. Data collected during tests and experiments opened new insight of plasma technology for processing PCB waste in small scale and without pre-processing steps.