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Comparative supercapacitance performance of CuO nanostructures for energy storage device applications

机译:储能器件应用中CuO纳米结构的比较超级电容性能

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摘要

In the present study, three different morphologies of copper oxide (CuO) nanostructures; bud-, flower-and plate-shaped CuO structures were synthesized by a simple chemical method. Binder-included pseudocapacitor electrodes were prepared using bud-and flower-shaped CuO structures whereas, directly grown CuO-nanoplates on Ni foam were used as a binder-free electrode in a three-electrode setup for electrochemical studies. Remarkably, the binder-free CuO nanoplates electrode exhibited excellent specific capacitance of 536 F g(-1) at a current density of 2 A g(-1), whereas the binder-included electrodes of bud-and flower-shaped CuO exhibited 230 F g(-1) and 296 F g(-1), respectively, at a current density of 0.7 A g(-1) in a 6 M KOH electrolyte. The cycling retention test and charge/discharge stability for the binder-free CuO nanoplates electrode showed 94% capacity retention after 2000 cycles and capacitance loss of only 11.3% over similar to 1000 cycles at a current density of 4 A g(-1) from charge/discharge measurements. Also, the binder-free CuO electrode showed higher energy and power densities of 29.4 W h kg(-1) and 12.7 W kg(-1), respectively, at 1.96 A g(-1) in an asymmetrical device, when compared to the binder-included electrode of flower-shaped CuO.
机译:在本研究中,氧化铜(CuO)纳米结构的三种不同形态。通过简单的化学方法合成了芽状,花状和板状的CuO结构。使用芽状和花状CuO结构制备包含粘合剂的伪电容器电极,而在三电极设置中,将在Ni泡沫上直接生长的CuO纳米板用作无粘合剂电极用于电化学研究。值得注意的是,无粘合剂的CuO纳米板电极在2 A g(-1)的电流密度下显示出536 F g(-1)的优异比电容,而芽状和花形CuO的含粘合剂的电极则显示出230 Fg(-1)。在6 M KOH电解质中,电流密度为0.7 A g(-1)时,分别为F g(-1)和296 F g(-1)。无粘结剂的CuO纳米板电极的循环保持测试和充电/放电稳定性表明,在电流密度为4 A g(-1)的情况下,经过1000次循环后,经过2000次循环后,容量保持率为94%,电容损耗仅为11.3%。充电/放电测量。同样,与非粘合剂相比,在非对称装置中,在1.96 A g(-1)下,无粘合剂的CuO电极在1.96 A g(-1)下的能量和功率密度分别更高,分别为29.4 W h kg(-1)和12.7 W kg(-1)。花状CuO的含粘合剂的电极。

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