Process for the preparation of radiation curable compositions

摘要

A process is described for the preparation of a radiation curable composition as well as its use for making adhesives and/or pressure sensitive adhesives. Solvent and solventless processes for the production of radiation curable adhesives have a number of disadvantages. The solventborne processes can involve multiple stages and it can be difficult to completely remove all the solvent. The solventless processes can result in small quantities of residual monomer remaining in the final formulation, which may be a health hazard when handling the prepolymerised syrup or even handling the final cured coating.