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Effective optimization of surface passivation on porous silicon carbide using atomic layer deposited Al2O3

机译:利用原子层沉积Al2O3有效优化多孔碳化硅表面钝化

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摘要

Porous silicon carbide (B-N co-doped SiC) produced by anodic oxidation showed strong photoluminescence (PL) at around 520 nm excited by a 375 nm laser. The porous SiC samples were passivated by atomic layer deposited (ALD) aluminum oxide (Al2O3) films, resulting in a significant enhancement of the PL intensity (up to 689). The effect of thickness, annealing temperature, annealing duration and precursor purge time on the PL intensity of ALD Al2O3 films was investigated. In order to investigate the penetration depth and passivation effect in porous SiC, the samples were characterized by X-ray photoelectron spectroscopy (XPS) and time-resolved PL. The optimized passivation conditions (20 nm Al2O3 deposited at 160 degrees C with purge time of 20 s, followed by an annealing for 5 min at 350 degrees C) for porous SiC were achieved and the results indicate that surface passivation by ALD Al2O3 thin films is a very effective method to enhance the luminescence efficiency of porous SiC.
机译:阳极氧化产生的多孔碳化硅(B-N共掺杂SiC)在375 nm激光激发下,在520 nm左右表现出强烈的光致发光(PL)。多孔SiC样品被原子层沉积(ALD)氧化铝(Al2O3)薄膜钝化,导致PL强度显着增强(高达689%)。研究了厚度、退火温度、退火持续时间和前驱体吹扫时间对ALD Al2O3薄膜PL强度的影响。为了研究多孔SiC的穿透深度和钝化效应,采用X射线光电子能谱(XPS)和时间分辨PL对样品进行了表征。对多孔碳化硅进行了优化的钝化条件(160 °C沉积20 nm Al2O3,吹扫时间为20 s,然后在350°C下退火5 min),结果表明,ALD Al2O3薄膜表面钝化是提高多孔碳化硅发光效率的一种非常有效的方法。

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