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Wafer-level vapor cells filled with laser-actuated hermetic seals for integrated atomic devices

机译:晶圆级蒸汽电池,填充激光驱动的气密密封件,用于集成原子器件

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Atomic devices such as atomic clocks and optically-pumped magnetometers rely on the interrogation of atoms contained in a cell whose inner content has to meet high standards of purity and accuracy. Glass-blowing techniques and craftsmanship have evolved over many decades to achieve such standards in macroscopic vapor cells. With the emergence of chip-scale atomic devices, the need for miniaturization and mass fabrication has led to the adoption of microfabrication techniques to make millimeter-scale vapor cells. However, many shortcomings remain and no process has been able to match the quality and versatility of glass-blown cells. Here, we introduce a novel approach to structure, fill and seal microfabricated vapor cells inspired from the century-old approach of glass-blowing, through opening and closing single-use zero-leak microfabricated valves. These valves are actuated exclusively by laser, and operate in the same way as the "make-seals " and "break-seals " found in the filling apparatus of traditional cells. Such structures are employed to fill cesium vapor cells at the wafer-level. The make-seal structure consists of a glass membrane that can be locally heated and deflected to seal a microchannel. The break-seal is obtained by breaching a silicon wall between cavities. This new approach allows adapting processes previously restricted to glass-blown cells. It can also be extended to vacuum microelectronics and vacuum-packaging of micro-electro-mechanical systems (MEMS) devices.
机译:原子钟和光泵磁计等原子设备依赖于对细胞中所含原子的询问,其内部内容必须满足纯度和准确性的高标准。几十年来,玻璃吹制技术和工艺不断发展,以在宏观蒸汽电池中达到这样的标准。随着芯片级原子器件的出现,对小型化和大规模制造的需求导致采用微纳加工技术来制造毫米级蒸汽电池。然而,仍然存在许多缺点,并且没有一种工艺能够与玻璃吹制电池的质量和多功能性相媲美。在这里,我们介绍了一种新颖的结构、填充和密封微加工蒸汽电池的方法,其灵感来自百年历史的玻璃吹制方法,通过打开和关闭一次性零泄漏微加工阀门。这些阀门完全由激光驱动,其工作方式与传统电池填充装置中的“封口”和“断封”相同。这种结构用于在晶圆级填充铯蒸气电池。制造密封结构由玻璃膜组成,玻璃膜可以局部加热和偏转以密封微通道。断裂密封是通过破坏空腔之间的硅壁获得的。这种新方法可以调整以前仅限于玻璃吹制电池的工艺。它还可以扩展到真空微电子和微机电系统(MEMS)器件的真空封装。

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