Closing the Gap between Electronics and High Power Connectors: LIMBO A new welding approach for the joining of thick interconnectors on thermally-sensitive substrates

摘要

To integrate high power electronic components in conventionally low voltage environments, the joining of massive copper interconnectors on thermally-sensitive substrates poses a significant key processing step. However, conventional welding approaches deposit an excess of energy in the thermally-sensitive substrates. The laser impulse metal bonding process (LIMBO) applies a new welding approach in order to join thick copper interconnectors on a metallized substrate with a minimal thermal input into the substrate.