首页> 外文期刊>Journal of Applied Physics >CF4/O-2 PLASMA INDUCED DAMAGE IN SI-IMPLANTED N-TYPE GAAS CRYSTALS
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CF4/O-2 PLASMA INDUCED DAMAGE IN SI-IMPLANTED N-TYPE GAAS CRYSTALS

机译:CF4/O-2等离子体诱导的SI注入N型GAAS晶体损伤

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The CF4/O-2 Or CF4 plasma induced damage in Si-implanted It-type GaAs crystals has been investigated by using Hall measurement and secondary ion mass spectrometry (SIMS) analysis. We found that sheet resistance degraded after plasma exposure and postannealing. The degradation of the sheet resistance during postannealing at 200-400 degrees C, is mainly associated with the reduction of carrier density in the crystal. From SIMS analysis, fluorine contamination was observed in the surface region of GaAs crystals after CF4/O-2 plasma exposure. The internal diffusion of fluorine atoms and the localization of fluorine in the Si-implanted a-type GaAs layer, were observed after postannealing at 400 degrees C. Based on these findings, a fluorine passivation related model is proposed, where Si-F bonds are formed in the Si-implanted a-type GaAs crystals. (C) 1997 American Institute of Physics. References: 10
机译:通过霍尔测量和二次离子质谱(SIMS)分析研究了CF4/O-2或CF4等离子体在Si注入It型GaAs晶体中诱导的损伤。我们发现在等离子体暴露和退火后,片状电阻下降。在200-400°C的后退火过程中,薄层电阻的降低主要与晶体中载流子密度的降低有关。根据SIMS分析,在CF4/O-2等离子体暴露后,在GaAs晶体的表面区域观察到氟污染。在400°C后退火后,观察到氟原子的内部扩散和氟在Si注入的a型GaAs层中的定位,基于这些发现,提出了一种氟钝化相关模型,其中Si-F键在Si注入的a型GaAs晶体中形成。(C) 1997年美国物理研究所。[参考资料: 10]

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