机译:在室温下测试的倒装芯片复合焊点中电流拥挤和焦耳热对电迁移引起的故障的影响 - 艺术。编号 013715
Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA;
UNDER-BUMP-METALLIZATION; VOID FORMATION; EUTECTIC SNPB; INTERCONNECTS; TECHNOLOGY; SIMULATION; MECHANISM;
机译:Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints
机译:Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer
机译:Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging