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Water at Hydrophobic Substrates:Curvature,Pressure,and Temperature Effects

机译:疏水基材上的水:曲率,压力和温度影响

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We studied the water density profile close to spherical and planar hydrophobic objects using molecular dynamics (MD) simulations.For normál pressure and room temperature,the depletion layer thickness of a planar substráte is ~2.5 á.Even for quite large spherical solutes with a rádius of R = 18 A,the depletion layer thickness is reduced by 30%,which shows that substráte curvature and roughness is an experimentally important factor.Rising temperature leads to a substantial increase of the depletion layer thickness.The compressibility of the depletion layer is found to be surprisingly smáli and only -5 times higher than that of bulk water.A high electrostatic surface potential of 0.5 V is found,which presumably plays an important role in the presence of charged solutes,since it can promote adsorption into the interfacial layer.
机译:我们使用分子动力学(MD)模拟研究了接近球形和平面疏水物体的水密度分布。在常压和室温下,平面基质的耗尽层厚度约为2.5á。甚至对于具有rádius的相当大的球形溶质R = 18 A时,耗尽层厚度减少了30%,这表明实验曲率和粗糙度是重要的实验因素。温度升高导致耗尽层厚度大幅增加。发现耗尽层的可压缩性令人惊奇的是,它仅比散装水高-5倍。发现0.5 V的高静电表面电势,据推测在带电溶质的存在下起着重要作用,因为它可以促进吸附到界面层中。

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