Dependence of the stress-temperature coefficient on dislocation density in epitaxial GaN grown on α-Al_(2)O_(3) and 6H-SiC substrates

摘要

We report measurements of stress in GaN epitaxial layers grown on 6H-SiC and α-Al_(2)O_(3) substrates. Biaxial stresses span +1.0 GPa (tensile) to -1.2 GPa (compressive). Stress determined from curvature measurements, obtained using phase-shift interferometry (PSI) microscopy, compare well with measurements using accepted techniques of x-ray diffraction (XRD) and Raman spectroscopy. Correlation between XRD and Raman measurements of the E_(2)~(2) phonon gives a Raman-stress factor of -3.4±0.3 cm~(-1)/GPa. We apply PSI microscopy for temperature dependent stress measurements of the GaN films. Variations found in the stress-temperature coefficient correlate well with threading dislocation densities. We develop a phenomenological model which describes the thermal stress of the epitaxial GaN as a superposition of that for ideal GaN and the free volume existing in the layers due to the threading dislocations. The model describes well the observed dependence.