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Diamond growth by hollow cathode arc plasma chemical vapor deposition

机译:通过空心阴极电弧等离子体化学气相沉积法生长金刚石

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摘要

Hollow cathode are plasma chemical vapor deposition was employed to grow crystalline diamond films using 1.5 to 7 of methane in hydrogen. The growth rate was as high as 3.2 mu/h when using 5 CH4/H-2 at a pressure of 15 Torr and a substrate temperature of 1083 K. However, an intermediate layer of several hundred nanometers was observed at the him-substrate interface by cross-section SEM. Raman and XPS characterizations showed that the interfacial layer consisted of sp(2) carbon and TaC with Ta vaporized from the hot cathode tube. XRD and XPS results further showed that the deposited diamond films also contained TaC. Ta composition in the film increased with the increase of growth pressure, the reduction of substrate temperature, and the increase of H-2 how in the Ta tube. The diamond films deposited by using CHCl3 as carbon source had Ta concentrations one order of magnitude higher than those using CH4, as shown by XPS results, but the nucleation densities using CHCl3 were always higher than those using CH4. References: 27
机译:空心阴极是等离子体化学气相沉积法,使用1.5%至7%的甲烷在氢气中生长结晶金刚石薄膜。在15 Torr压力和1083 K的基底温度下,使用5% CH4/H-2时,生长速率高达3.2 μ/h。然而,通过横截面扫描电镜在him-衬底界面处观察到了几百纳米的中间层。 拉曼和XPS表征表明,界面层由sp(2)碳和TaC组成,Ta从热阴极管中蒸发。XRD和XPS结果进一步表明,沉积的金刚石薄膜还含有TaC。薄膜中的Ta成分随着生长压力的增加、基板温度的降低和Ta管中H-2的增加而增加。如XPS结果所示,以CHCl3为碳源沉积的金刚石薄膜的Ta浓度比使用CH4的金刚石薄膜高一个数量级,但使用CHCl3的成核密度始终高于使用CH4的金刚石密度。[参考资料: 27]

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