ENHANCING DIMENSIONAL MEASUREMENT RESOLUTION AND ACCURACY IN MACHINE VISION INSPECTION WITH SUB-PIXEL MEASUREMENT TECHNIQUE

摘要

Modern trend of non-contact measurement has found more attention towards image analysis. This kind of technique is of interest due to capabilities shown in terms of quality and quantity of measurement. To improve measurement resolutions, it is required to select higher resolution cameras. The cost of system increases exponentially with the higher resolution. In CCD device every pixel is inferred by surrounding pixels, the value of pixel has shown structured relation between nearby pixels. Advantage of this phenomenon is taken for measurements within the pixels. Behavior of pixel variation is studied to set non-linear curve between pixels. With this technique major Improvement in resolution and accuracy is found and the technique of measurement and results are discussed in this paper with its application in radius measurement of impact.