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首页> 外文期刊>Minerals Engineering >Comparison of the electrochemical mechanism of chalcopyrite dissolution in the absence or presence of Sulfolobus metallicus at 70 °C
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Comparison of the electrochemical mechanism of chalcopyrite dissolution in the absence or presence of Sulfolobus metallicus at 70 °C

机译:在70°C下不存在或存在金属硫磺的情况下黄铜矿溶解的电化学机理比较

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摘要

The electrochemical mechanisms of chalcopyrite dissolution in the absence and presence of Sulfolobus metallicus at 70 °C were studied using cyclic voltammetry and Tafel methods. The cyclic voltammetry experiments show that S. metallicus does not change the oxidative and reductive mechanisms of chalcopyrite dissolution. The initial oxidation potentials of chalcopyrite dissolution are equal in the absence and presence of S. metallicus. However, the current density of oxidation in the presence of S. metallicus increases significantly. At about 0 V, the products on the surface of chalcopyrite are CuS, elemental S°, and Fe~(2+). At about 0.384 V, CuS may be oxidized, and chalcopyrite may be transferred to CuO, Fe_2O_3, and elemental S°. The Tafel experiments show that S. metallicus may increase the corrosion potential and corrosion current density of chalcopyrite. S. metallicus may also reduce the polarization resistance of chalcopyrite in bioleaching. These results indicate that S. metallicus may accelerate the oxidation of chalcopyrite.
机译:利用循环伏安法和Tafel方法研究了在70℃不存在和存在金属硫磺的情况下黄铜矿溶解的电化学机理。循环伏安法实验表明金属链霉菌不会改变黄铜矿溶解的氧化和还原机理。在不存在和存在金属链霉菌的情况下,黄铜矿溶解的初始氧化电位相等。然而,在金属链霉菌存在下的氧化电流密度显着增加。在约0 V时,黄铜矿表面的产物为CuS,元素S°和Fe〜(2+)。在约0.384 V时,CuS可能被氧化,黄铜矿可能转移到CuO,Fe_2O_3和元素S°。 Tafel实验表明,金属链霉菌可以增加黄铜矿的腐蚀电位和腐蚀电流密度。金属链霉菌还可能降低生物浸出过程中黄铜矿的极化电阻。这些结果表明金属链霉菌可以加速黄铜矿的氧化。

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