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首页> 外文期刊>Micron: The international research and review journal for microscopy >Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
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Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions

机译:等离子体增强原子层沉积制备的Ru / Pt纳米复合膜的结构研究

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摘要

We have fabricated Ru and Pt nanocomposite films using plasma-enhanced atomic layer deposition (PE-ALD), and characterized their structure by means of analytical electron microscopy. Pt and Ru were deposited in Ar/O-2 plasma using trimethyl(methylcyclopentadienyl) platinum(IV) and bis(cyclopentadienyl)Ru(II) or bis(ethylcyclopentadienyl)Ru(II) as precursors, respectively. The resistivity of a Pt film deposited on a Si substrate at 300 degrees C was 16.2 mu Omega cm, and that of a Ru film was as low as 11 mu Omega cm, showing the film to be metallic and not oxidized. It was revealed that the film prepared by successive PE-ALDs of Pt and Ru on a thin amorphous carbon substrate for electron microscopy analysis is a nanocomposite of Ru ribbons and PtRu (7:3) alloy ribbons with 2-3 nm in width. The Ru ribbon comprised small particles with poor crystallinity of the hcp A3 structure and the PtRu ribbon comprised crystallites with good crystallinity of the fcc Al structure. The atomic layer deposition would be one of potential techniques to produce Ru/Pt nanocomposites for fuel cell catalysts. (C) 2015 Elsevier Ltd. All rights reserved.
机译:我们使用等离子增强原子层沉积(PE-ALD)制备了Ru和Pt纳米复合膜,并通过分析电子显微镜表征了其结构。分别使用三甲基(甲基环戊二烯基)铂(IV)和双(环戊二烯基)Ru(II)或双(乙基环戊二烯基)Ru(II)作为前体,将Pt和Ru沉积在Ar / O-2等离子体中。在300℃下沉积在Si衬底上的Pt膜的电阻率为16.2μΩ·cm,而Ru膜的电阻率低至11μΩ·cm,表明该膜是金属的而不被氧化。揭示了在薄的无定形碳基底上通过连续的Pt和Ru的PE-ALDs进行电子显微镜分析而制备的膜是Ru条带和PtRu(7:3)合金条带的纳米复合材料,其宽度为2-3 nm。 Ru带包含hcp A3结构的结晶性差的小颗粒,而PtRu带包含fcc Al结构的良好结晶性的微晶。原子层沉积将是生产用于燃料电池催化剂的Ru / Pt纳米复合材料的潜在技术之一。 (C)2015 Elsevier Ltd.保留所有权利。

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