CHEMICAL VAPOUR DEPOSITION TECHNIQUE USED FOR COATINGS AN ASSESSMENT OF CURRENT STATUS

摘要

Chemical vapor deposition is a versatile deposition technique that provides a means of growing thin films of elemental and compound semiconductors, metal alloys and amorphous or crystalline compounds of different stoichiometry. The chemistry richness of a CVD process makes the technique so versatile and capable of producing a vast range of layers with different compositions, structures and properties. CVD is to be distinguished from physical vapour deposition (PVD), which also produces a thin film on a surface from the gaseous phase but without any chemical reaction. CVD processes for producing thin films and coatings have found increasing applications in technologies as the fabrication of solid-state electronic devices, the manufacture of ball bearings, cutting tools, production of rocket engine and nuclear reactor components. Because CVD processes do not require vacuum or unusual levels of electric power, they were practiced commercially prior to PVD. In this article the authors provide the basics definitions of CVD technique and some useful practical insights into CVD technology, of how microstructures evolve, and how CVD processes can be controlled to produce thin films tailored to practical needs.