首页> 外文期刊>Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science >Improvement in the Shape Memory Response of Ti_(50.5)Ni_(24.5)Pd_(25) High-Temperature Shape Memory Alloy with Scandium Microalloying
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Improvement in the Shape Memory Response of Ti_(50.5)Ni_(24.5)Pd_(25) High-Temperature Shape Memory Alloy with Scandium Microalloying

机译:Scan微合金化改善Ti_(50.5)Ni_(24.5)Pd_(25)高温形状记忆合金的形状记忆响应

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摘要

A Ti_(50.5)Ni_(24.5)Pd_(25) high-temperature shape memory alloy (HTSMA) is microalloyed with 0.5 at. pct scandium (Sc) to enhance its shape-memory characteristics, in particular, dimensional stability under repeated thermomechanical cycles. For both Ti_(50.5)Ni_(24.5)Pd_(25) and the Sc-alloyed material, differential scanning calorimetry is conducted for multiple cycles to characterize cyclic stability of the transformation temperatures. The microstructure is evaluated using electron microscopy, X-ray diffractometry, and wavelength dispersive spectroscopy. Isobaric thermal cycling experiments are used to determine transformation temperatures, dimensional stability, and work output as a function of stress. The Sc-doped alloy displays more stable shape memory response with smaller irrecoverable strain and narrower thermal hysteresis than the baseline ternary alloy. This improvement in performance is attributed to the solid solution hardening effect of Sc.
机译:Ti_(50.5)Ni_(24.5)Pd_(25)高温形状记忆合金(HTSMA)与0.5 at。 pct dium(Sc)可增强其形状记忆特性,尤其是在重复的热机械循环下的尺寸稳定性。对于Ti_(50.5)Ni_(24.5)Pd_(25)和Sc合金材料,均需进行多个循环的差示扫描量热法,以表征相变温度的循环稳定性。使用电子显微镜,X射线衍射法和波长色散光谱法评估微观结构。等压热循环实验用于确定相变温度,尺寸稳定性以及作为应力函数的功输出。与基线三元合金相比,掺Sc的合金显示出更稳定的形状记忆响应,具有较小的不可恢复的应变和较窄的热滞。性能的提高归因于Sc的固溶硬化作用。

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