首页> 外文期刊>Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science >Evolution of Microstructure in Brazed Joints of Austenitic-Martensitic Stainless Steel with Pure Silver Obtained with Ag-27Cu-5Sn Brazing Filler Material
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Evolution of Microstructure in Brazed Joints of Austenitic-Martensitic Stainless Steel with Pure Silver Obtained with Ag-27Cu-5Sn Brazing Filler Material

机译:Ag-27Cu-5Sn钎料获得的纯银奥氏体-马氏体不锈钢钎焊接头的组织演变

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摘要

Brazing of an austenitic-martensitic stainless steel (AMSS) with pure silver was carried out at 1053 K, 1073 K, and 1093 K (780 A degrees C, 800 A degrees C, and 820 A degrees C) with Ag-27Cu-5Sn (wt pct) as brazing filler material (BFM). Wettability of the liquid BFM over base AMSS surface was found to be poor. Application of nickel coating to the steel was observed to enhance the wettability and to enable the formation of a good bond between BFM and the steel. The mechanism responsible for enhanced metallurgical bonding of the BFM with AMSS in the presence of nickel coating was explained based on diffusional interactions and uphill diffusion of iron, chromium and nickel observed in the brazed microstructure. Good diffusion-assisted zone was observed to form on silver side at all three temperatures. Four phases were encountered within the joint including silver solid solution, copper solid solution, Cu3Sn intermetallic and Ni-Fe solid solution. The Cu3Sn intermetallic was present in small amounts in the joints brazed at 1053 K and 1073 K (780 A degrees C and 800 A degrees C). The joint formed at 1093 K (820 A degrees C) exhibited the absence of Cu3Sn, fewer defects and larger diffusion-assisted zone. Hardness of base AMSS was found to reduce during brazing due to austenite reversion and post-brazing sub-zero treatment for 2.5 hours was found suitable to recover the hardness.
机译:用纯银在1053 K,1073 K和1093 K(780 A,800 A和820 A)下用Ag-27Cu-5Sn钎焊奥氏体-马氏体不锈钢(AMSS) (wt pct)作为钎料(BFM)。发现液体BFM在基本AMSS表面上的润湿性差。观察到在钢上涂镍涂层可提高润湿性,并能在BFM和钢之间形成良好的粘结。基于在钎焊显微组织中观察到的铁,铬和镍的扩散相互作用和上坡扩散,解释了在镍涂层存在下,BFM与AMSS增强冶金结合的机理。在所有三个温度下,在银侧均观察到良好的扩散辅助区。接头内遇到四个相,包括银固溶体,铜固溶体,Cu3Sn金属间化合物和Ni-Fe固溶体。 Cu3Sn金属间化合物少量存在于以1053 K和1073 K(780 A和800 A摄氏度)钎焊的接头中。在1093 K(820 A摄氏度)形成的接头表现出Cu3Sn的缺失,缺陷少和扩散辅助区大。发现基体AMSS的硬度在钎焊过程中由于奥氏体回复而降低,并且发现钎焊后亚零度热处理2.5小时适合恢复硬度。

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