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Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper under Tensile Deformation at Room Temperature

机译:室温拉伸变形下块状超细晶粒铜的同时晶粒生长和细化

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摘要

Grain growth and grain refinement behavior during deformation determine the strength and ductility of ultrafine-grained materials. We used asymmetric cryorolling to fabricate ultrafine-grained copper sheets with an average grain width of 230 nm and having a laminate structure. The sheets show a high-true failure strain of 1.5. Observation of the microstructure at the fracture surface reveals that ultrafine laminate-structured grains were simultaneously transformed into both equiaxed nanograins and coarse grains under tensile deformation at room temperature.
机译:变形过程中的晶粒长大和晶粒细化行为决定了超细晶粒材料的强度和延展性。我们使用非对称低温轧制工艺制造了平均晶粒宽度为230 nm并具有层压结构的超细晶粒铜板。片材显示出1.5的高真实破坏应变。观察断裂表面的微观结构表明,在室温下,拉伸状态下,超细层压结构晶粒同时转变为等轴纳米晶粒和粗晶粒。

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