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首页> 外文期刊>Materials Characterization >Optimization of interpass annealing for a minimum recrystallized grain size and further grain refinement towards nanostructured AA6063 during equal channel angular pressing
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Optimization of interpass annealing for a minimum recrystallized grain size and further grain refinement towards nanostructured AA6063 during equal channel angular pressing

机译:在最小通道中退火的优化,以最小化再结晶晶粒尺寸,并在等通道角挤压过程中进一步向纳米结构AA6063细化晶粒

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摘要

Grain structure evolving during severe plastic deformation (SPD) and interpass annealing strongly influences grain refinement occurring during subsequent SPD. The aim of this research was to determine an optimum interpass annealing condition that could lead to the formation of a nanostructure of the AA6063 alloy during subsequent equal channel angular pressing (ECAP). Different interpass annealing temperatures and times as well as different prior ECAP passes were used to define an optimum annealing condition that led to a minimum grain size for further ECAP by route A. TEM confirmed the attainment of nano-scale grains with sizes around 500 nm after six passes of ECAP. EBSD revealed the majority of grain boundaries being high-angle ones. (C) 2015 Elsevier Inc. All rights reserved.
机译:在严重的塑性变形(SPD)和道间退火期间,晶粒结构的演变强烈影响随后的SPD过程中发生的晶粒细化。这项研究的目的是确定最佳的道间退火条件,该条件可能导致在随后的等通道角挤压(ECAP)期间形成AA6063合金的纳米结构。使用不同的道次间退火温度和时间以及不同的先前ECAP道次来定义最佳退火条件,该最优退火条件导致通过路径A进一步实现ECAP的最小晶粒尺寸。TEM证实了纳米晶粒尺寸在达到500 nm后得以实现ECAP六次通过。 EBSD揭示,大多数晶界是大角度晶界。 (C)2015 Elsevier Inc.保留所有权利。

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