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首页> 外文期刊>Materials transactions >Misorientation Change of the Grain Boundary in Pure Copper Bicrystals Subjected to One-Pass Equal-Channel Angular Pressing
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Misorientation Change of the Grain Boundary in Pure Copper Bicrystals Subjected to One-Pass Equal-Channel Angular Pressing

机译:单通道等通道角挤压下纯铜双晶中晶界的取向错误变化

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Grain boundaries can change their misorientation by absorbing lattice dislocations at relatively high temperature under moderate straining. The same phenomenon is believed to occur during severe plastic deformation down to room temperature leaving grain boundaries in the nonequilibrium state. Direct evidence of misorientation change of the grain boundary during severe plastic deformation was obtained in copper bicrystals subjected to equal-channel angular pressing (ECAP) for one pass. Marked dependence of misorientaion change on the initial orientation was revealed, and is associated with the unique slip patterns of ECAP, where the shear deformation is restricted to the narrow zone parallel to the intersecting plane of the two channels. The degree of change can be related to slip geometry in terms of grain boundary plane orientation.
机译:晶界可以通过在相对高的温度下在中等应变下吸收晶格位错来改变其取向差。据信在下降到室温的剧烈塑性变形期间会发生相同的现象,使晶界处于非平衡状态。在经过等通道角压(ECAP)一次的铜双晶中,获得了在严重塑性变形过程中晶界取向错误变化的直接证据。揭示了错向错位变化对初始方向的显着依赖性,并且与ECAP的独特滑动模式有关,在该模式下,剪切变形被限制在平行于两个通道相交平面的狭窄区域。变化的程度可以根据晶界平面取向与滑移几何形状相关。

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