首页> 外文期刊>Materials transactions >Influence of Copper Addition to #alpha#-Fe_2Si_5 on Thermoelectric Properties of Iron-Silicides Produced by Spark-Plasma Sintering
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Influence of Copper Addition to #alpha#-Fe_2Si_5 on Thermoelectric Properties of Iron-Silicides Produced by Spark-Plasma Sintering

机译:#alpha#-Fe_2Si_5中添加铜对火花等离子体烧结产生的硅铁的热电性能的影响

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摘要

Thermoelectric materials of #alpha#-Fe_(0.91)Mn_(0.09)Si_(2.5) + x mass percent Cu (0 <= x <= 2) were produced by spark-plasma sintering (SPS) and their thermoelectric properties were investigated. The densification was completed in sixty seconds after the temperature reached 1173 K. Liquid phase sintering most likely occurred during the heating because the addition of copper promoted the densification. The relative density of the sintered specimen was between 88 and 90 percent. When (#alpha# + #epsilon#)-phase powder, which corresponds to the #beta#-phase composition, was used as the starting material, the eutectoid reaction (#alpha#-> #beta# + Si) mainly occurs at 943 K. However, there was no #beta#-phase in the #alpha#-phase specimen annealed under the same conditions. It was clear that the #epsilon#-phase accelerates the eutectoid reaction. Copper accelerates transformation to the #beta#-phase. The eutectoid reaction was completed within only 300 5 at 943 or 973 K, and also occurred at 1003 K but the rate was very low. Compared with the (#alpha# + #epsilon#)-phase specimen, the power factor of the a-phase specimen was very low, because the electrical resistivity of the #alpha#-phase specimen was larger than that of the (#alpha# + #epsilon#)-phase specimen. The silicon grains dispersed in the matrix should be an obstacle to the electrical conduction. The annealing conditions were controlled so that the coarsening of the silicon particles would improve the electrical resistivity. The electrical resistivity was not improved, though the silicon grains could be coarsened. An excess amount of copper and an excess annealing time had a negative influence on the Seebeck coefficient and the power factor. This phenomenon was also observed in the (#alpha# + epsilon#)-phase specimen. Fe_(0.91)Mn_(0.09)Si_(2.5) + 20 mass percent Cu alloy was produced to analyze the reaction between copper and Fe_(0.91)Mn_(0.09)Si_(2.5) in detail. It was revealed from EPMA results that the composition of the #beta#-phase was shifted from the nominal composition. The copper-rich phase is considered to a eutectic composition of Cu-30 at percent Si, and it has little thermoelectric properties. The optimum composition was Fe_(0.91)Mn_(0.09)Si_(2.5) + 0.5 percent Cu, and the optimum annealing conditions were 300 s at 973 K. The power factor of the optimum specimen was about 74 percent of that of the optimum (#alpha# + #epsilon#)-phase specimen.
机译:通过火花等离子体烧结(SPS)生产#alpha#-Fe_(0.91)Mn_(0.09)Si_(2.5)+ x质量百分比的Cu(0 <= x <= 2)的热电材料,并研究了它们的热电性能。在温度达到1173 K之后的六十秒内完成了致密化。液相烧结最有可能在加热过程中发生,因为添加铜促进了致密化。烧结样品的相对密度在88%至90%之间。当将与#beta#相组成相对应的(#alpha#+#epsilon#)相粉末用作起始原料时,共析反应(#alpha#->#beta#+ Si)主要在943K。但是,在相同条件下退火的#alpha#相样品中没有#beta#相。显然,#ε相促进了共析反应。铜加速了向#beta#相的转变。共析反应仅在943或973 K时在300 5内完成,并在1003 K时发生,但发生率很低。与(#alpha#+#epsilon#)相样品相比,a相样品的功率因数非常低,因为#alpha#相样品的电阻率大于(#alpha #+#epsilon#)相标本。分散在基体中的硅颗粒应该成为导电的障碍。控制退火条件,使得硅颗粒的粗化将改善电阻率。尽管可以粗化硅晶粒,但是电阻率没有改善。过量的铜和过量的退火时间对塞贝克系数和功率因数有负面影响。在(#alpha#+ epsilon#)相样品中也观察到此现象。制备了Fe_(0.91)Mn_(0.09)Si_(2.5)+ 20质量百分比的Cu合金,以详细分析铜与Fe_(0.91)Mn_(0.09)Si_(2.5)的反应。从EPMA结果表明,#β#相的组成偏离标称组成。富铜相被认为是Si含量为Cu-30的低共熔组成,并且几乎没有热电性能。最佳组成为Fe_(0.91)Mn_(0.09)Si_(2.5)+ 0.5%Cu,最佳退火条件为973 K下300 s。最佳试样的功率因数约为最佳( #alpha#+#epsilon#)相标本。

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