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首页> 外文期刊>Macromolecules >RELATIONSHIP BETWEEN THE STRUCTURE AND SLOW CRACK GROWTH IN BLENDS OF HIGH-DENSITY POLYETHYLENE AND MODEL COPOLYMERS
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RELATIONSHIP BETWEEN THE STRUCTURE AND SLOW CRACK GROWTH IN BLENDS OF HIGH-DENSITY POLYETHYLENE AND MODEL COPOLYMERS

机译:高密度聚乙烯与模型共聚物共混物的结构与慢速裂纹增长之间的关系

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The resistance to slow crack growth (SCG) was investigated in binary blends of high-density polyethylene (HDPE) and a model monodispersed ethylene-butene copolymer. The results were correlated with the morphological structure of the blends by a simple quantitative theory. The time to failure (t(f)) depended on crystallinity, crystal thickness, and most importantly the intrinsic resistance to SCG of the crystal network as determined by the density and branching of its tie molecule. t(f) was measured from 30 to 80 degrees C. At lower testing temperatures from 30 to 60 degrees C, the blend with the thinnest crystals had the longest t(f). However, at the higher temperature of 80 degrees C, the blend with the thinnest crystals became weaker relative to the blends with thicker crystals. The activation energy increased as the crystal thickness decreased. [References: 13]
机译:在高密度聚乙烯(HDPE)和模型单分散乙烯-丁烯共聚物的二元共混物中研究了抗慢裂纹扩展(SCG)的性能。通过简单的定量理论,结果与共混物的形态结构相关。失效时间(t(f))取决于结晶度,晶体厚度,最重要的是取决于晶体网络的SCG固有抗性,这取决于其键分子的密度和分支。 t(f)在30到80摄氏度下测量。在30到60摄氏度的较低测试温度下,晶体最薄的混合物的t(f)最长。然而,在80℃的较高温度下,具有最薄晶体的共混物相对于具有较厚晶体的共混物变弱。活化能随着晶体厚度的减小而增加。 [参考:13]

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