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Fundamental and Advanced Technologies: Design and Manufacturing Support Technologies, Materials Technology, Incubation Technology

机译:基础和先进技术:设计和制造支持技术,材料技术,孵化技术

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In July 2012, Fuji Electric adopted a new brand statement, "Innovating Energy Technology," which reflects its ongoing "pursuit of innovation in electric and thermal energy technology in order to create products that maximize the efficient utilization of energy and to contribute to the creation of responsible and sustainable societies." Underpinning the realization of this goal is design and manufacturing support technology. Design and manufacturing support technology is being developed in close cooperation with the departments that actually develop products. Fuji Electric has newly developed a spectroscopic analysis method based on radiated light and infrared light, and with the addition of various types of microscopic analysis has established comprehensive techniques for analyzing gate oxide interfaces, crystal defects and the like. These techniques have been used in such applications as the development of SiC (silicon carbide) devices, which are currently the focus of attention as next-generation semiconductor devices, and are making positive contributions. Additionally, Fuji Electric aims to increase the efficiency of materials development through using molecular dynamics calculations and first-principle calculations to develop materials design technology for designing resin material structures and additives used in semiconductor interface structures and semiconductor packages. To increase the reliability of semiconductor devices, Fuji Electric has developed micro strain distribution measurement and evaluation technology for the contacts in semiconductor packages. In addition, so that these advances can be applied to improve insulation in semiconductor modules and to increase the breakdown voltage, Fuji Electric has established technology for visualizing partial discharge inside a module, and has clarified the mechanism by which partial discharges are generated.
机译:2012年7月,富士电机采用了新的品牌声明“创新能源技术”,这反映了富士通不断进行的“对电能和热能技术的追求,以创造出能够最大限度地利用能源并为创造做出贡献的产品”负责任和可持续的社会。”设计和制造支持技术是实现此目标的基础。正在与实际开发产品的部门密切合作,开发设计和制造支持技术。富士电机新开发了一种基于辐射光和红外光的光谱分析方法,并且除了各种类型的显微分析外,还建立了用于分析栅极氧化物界面,晶体缺陷等的综合技术。这些技术已被用于诸如SiC(碳化硅)器件的开发等应用中,这些应用当前已成为下一代半导体器件的关注焦点,并做出了积极的贡献。此外,富士电机的目标是通过使用分子动力学计算和第一性原理计算来开发材料设计技术,以设计用于半导体界面结构和半导体封装的树脂材料结构和添加剂,从而提高材料开发的效率。为了提高半导体器件的可靠性,富士电机开发了用于半导体封装中触点的微应变分布测量和评估技术。此外,为了使这些进步可用于改善半导体模块的绝缘性并提高击穿电压,富士电机建立了可视化模块内部局部放电的技术,并阐明了产生局部放电的机理。

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