Porex (www.porexfiltration.com) have introduced a crossflow ultrafilter technology that has been designed for applications such as wafer grinding where fine, abrasive silicon particles and colloidal silica particles range between 20 and 50 nm (0.02-0.05 microns). The durable 20 nm membrane surface, which incorpo-rates the same anchored membrane technology (membrane-to-substrate bond) as standard Porex TMF membranes, is able to withstand the sharp silicon mi-cro-particles that can quickly damage many other types of membrane materials.
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