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首页> 外文期刊>Forest Products Journal >Effect of process parameters on fungal resistance of MDF panels
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Effect of process parameters on fungal resistance of MDF panels

机译:工艺参数对中密度纤维板抗真菌性的影响

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摘要

A study was conducted at Forintek Canada Corporation to investigate the effects of different refining process conditions and resin contents on mold growth rates. A refining experiment was carried out with a fractional factorial design. Preheating retention time, steam pressure, resin content, and panel density were chosen as the factors, each at two different levels. Twenty-four laboratory panels were made with eight different manufacturing processes. Mold growth on the medium density fiberboard (MDF) panels was quantified according to a modified ASTM standard (D 3273-94). Experimental results showed that preheating temperature and moisture content at the completion of the mold growth test positively correlated to the mold growth rate. Mold growth rate was lower with higher panel modulus of rupture (MOR) tested after a 1-hour boiling treatment and higher initial moisture. To a lesser extent, mold growth was reduced with increased resin content and dry panel MOR.
机译:Forintek Canada Corporation进行了一项研究,以研究不同的精炼工艺条件和树脂含量对霉菌生长速率的影响。用分数阶乘设计进行了精炼实验。选择预热保留时间,蒸汽压力,树脂含量和面板密度作为因素,每个因素处于两个不同的水平。用八种不同的制造工艺制造了二十四个实验室面板。根据改进的ASTM标准(D 3273-94)对中密度纤维板(MDF)面板上的霉菌生长进行了定量。实验结果表明,在完成霉菌生长试验时的预热温度和水分含量与霉菌的生长速率呈正相关。经过1小时的沸腾处理和较高的初始水分后,随着较高的面板断裂模量(MOR)测试,霉菌的生长速度较低。在较小程度上,随着树脂含量的增加和干板MOR的减少,霉菌的生长会减少。

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