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首页> 外文期刊>Foot and ankle international >The mechanical properties of the heel pad in unilateral plantar heel pain syndrome.
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The mechanical properties of the heel pad in unilateral plantar heel pain syndrome.

机译:在单侧足底足跟痛综合征中脚跟垫的机械性能。

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摘要

Plantar heel pain syndrome has been attributed to entrapment neuropathy, plantar fasciitis, calcaneal spurs, and stress fractures of the calcaneus. Although deteriorated mechanical properties of the heel pads may play an important role in the pathogenesis of heel pain syndrome, this has received little notice. In this study, a specially designed compression relaxation device with a push-pull scale and a 10-MHz linear array transducer was used to determine thickness of the heel pad under different loading conditions. Twenty consecutive patients aged 29 to 77 years with unilateral plantar heel pain syndrome were enrolled. Thickness of heel pad bilaterally was measured when the heel pad was compressed by serial increments of 0.5 kg to a maximum of 3 kg and then relaxed sequentially. The load-displacement curve during a loading-unloading cycle was plotted, and the compressibility index and energy dissipation ratio of the heel pad were calculated accordingly. Phase I displacement of the heel pad (from 0 to 1 kg load) on the painless side was greater than that on the painful side (P < 0.01), but there was no statistically significant difference between painless and painful sides in thickness of unloaded heel pads, compressibility index, or energy dissipation ratio (P > 0.05). In conclusion, the affected heel pad in plantar heel pain syndrome was stiffer under light pressure than the heel pad on the painless side. The changed nature of chambered adipose tissue in a painful heel pad may be responsible for its increased stiffness under light pressure.
机译:足跟痛综合征可归因于截瘫神经病,足底筋膜炎,跟骨骨刺和跟骨应力性骨折。尽管脚后跟垫机械性能的下降可能在脚后跟疼痛综合征的发病机理中起重要作用,但对此知之甚少。在这项研究中,特别设计的带有推挽秤和10 MHz线性阵列换能器的压缩松弛装置用于确定在不同载荷条件下的脚跟垫的厚度。纳入20例年龄在29至77岁之间的单侧plant足跟痛综合征患者。当脚跟垫以0.5 kg的连续增量压缩到最大3 kg,然后依次放松时,测量双侧脚跟垫的厚度。绘制了在加载-卸载循环期间的载荷-位移曲线,并据此计算了脚跟垫的可压缩指数和能量耗散率。无痛侧脚后跟垫的第一阶段位移(从0到1 kg载荷)大于疼痛侧(P <0.01),但无痛和无痛侧的后跟厚度在统计学上无显着差异垫,可压缩指数或能量耗散率(P> 0.05)。总之,在轻微压力下,足底足跟疼痛综合征的患足垫比无痛侧的足垫更硬。疼痛的脚跟垫中有腔脂肪组织的性质发生变化,可能是其在轻压下增加刚度的原因。

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