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首页> 外文期刊>Ferroelectrics >Metal-Ferroelectric-Semiconductor Field Effect Transistor (MFS-FET) for 1T-type FRAM Based on Polyvinylidene Fluoride (PVDF) Thin Film
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Metal-Ferroelectric-Semiconductor Field Effect Transistor (MFS-FET) for 1T-type FRAM Based on Polyvinylidene Fluoride (PVDF) Thin Film

机译:基于聚偏二氟乙烯(PVDF)薄膜的1T型FRAM的金属铁电半导体场效应晶体管(MFS-FET)

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The metal-ferroelectric-semiconductor field effect transistor (MFSFET) was fabricated using polyvinylidene fluoride (PVDF) thin film as a ferroelectric layer PVDF thin films of 4 and 6 wt percent were spin-coated on Si(100) wafers. Ferroelectric hystereytic curves inducing a counterclockwise loop, which means that the deposited PVDF pirns were crystallized with ferroelectric beta phase, was exhibited in the drain current-gale voltage (I_D-V_G ) characteristics ofMFSFET The memory window widths of the MFS FET were more than 1.6 V. The MFSFET that operates with the PVDF thin film used as a gate dielectric material is shown in the drain current-drain voltage (I_D-V_D) characteristics. The MFSFET using PVDF as ferroelectric layer has promising potential for use in low-voltage operable one transistor (1T) type ferroelectric random access memories (FeRAM) using organic material.
机译:使用聚偏二氟乙烯(PVDF)薄膜制造金属铁电半导体场效应晶体管(MFSFET),作为铁电层,将4%和6 wt%的PVDF薄膜旋涂在Si(100)晶片上。 MFSFET的漏极电流-盖尔电压(I_D-V_G)特征显示出铁电磁滞曲线引起逆时针环路,这意味着沉积的PVDF柱以铁电β相结晶。MFSFET的存储窗口宽度大于1.6 V.在漏极电流-漏极电压(I_D-V_D)特性中显示了与PVDF薄膜一起用作栅极电介质材料的MFSFET。使用PVDF作为铁电层的MFSFET在使用有机材料的低压可操作的一个晶体管(1T)型铁电随机存取存储器(FeRAM)中具有广阔的应用前景。

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