...
机译:
机译:Researchers' Work from Slovak University of Technology Bratislava Focuses on Metals Research (Characterizing the Soldering Alloy Type Zn-al-cu and Study of Ultrasonic Soldering of Al7075/cu Combination)
机译:Bonding of InP laser diodes by Au-Sn solder and tungsten-based barrier metallization schemes
机译:Base metal wires for gold alloy soldering to cast cobalt‐chromium alloy partial dentures
机译:SOLDER CHARGE SMT:新的SOLDER ATTACH技术的设计和验证
机译:study of Interfacial Reactions Between sn(Cu) solders and Ni-Co alloy Layers
机译:Cu-solder体系中金属间化合物生长及固 - 液界面润湿性的研究