首页> 外文期刊>European journal of orthodontics >Debonding characteristics of a polymer mesh base ceramic bracket bonded with two different conditioning methods.
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Debonding characteristics of a polymer mesh base ceramic bracket bonded with two different conditioning methods.

机译:用两种不同的调理方法粘结的聚合物网基陶瓷支架的脱粘特性。

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The aim of this study was to compare the shear bond strength (SBS) and debonding characteristics of a polymer mesh base ceramic bracket bonded with two different surface conditioning methods. InVu Readi-Base ceramic brackets were bonded to 100 human premolars with different etching protocols. With conventional method (CM), the teeth were etched with 37 per cent phosphoric acid for 30 seconds, while Transbond Plus self-etching primer (SEP) was applied as recommended by the manufacturer. SBS testing was performed on 25 samples of each group while the remaining 25 samples of each group were subjected to plier or machine debonding after thermocycling for 1000 cycles. The adhesive remnant index (ARI) was used to determine the amount of composite resin on the enamel. Statistical analysis included Kruskal-Wallis and Mann-Whitney U-tests and Weibull analysis. No significant difference was observed between the CM (9.22 MPa) and SEP (9.04 MPa) groups (P=0.684). ARI scores of machine and plier debonding for both groups showed a significant difference (P
机译:这项研究的目的是比较用两种不同的表面处理方法粘结的聚合物网基陶瓷支架的剪切粘结强度(SBS)和剥离特性。将InVu Readi-Base陶瓷支架通过不同的蚀刻方案粘合到100个人的前磨牙。采用常规方法(CM),用37%的磷酸对牙齿进行蚀刻30秒钟,然后按照制造商的建议使用Transbond Plus自蚀刻底漆(SEP)。在每组25个样品上进行SBS测试,而每组剩余的25个样品在热循环1000次之后进行钳子或机器剥离。粘合剂残留指数(ARI)用于确定牙釉质上复合树脂的含量。统计分析包括Kruskal-Wallis和Mann-Whitney U检验和Weibull分析。在CM(9.22 MPa)和SEP(9.04 MPa)组之间没有观察到显着差异(P = 0.684)。两组机器和钳子剥离的ARI评分均显示出显着差异(P <或= 0.0001)。用钳子剥离显示两组的ARI分数均为3。两组均观察到聚合物网孔基部断裂。然而,两组之间未观察到显着差异(chi(2)= 4.304,P = 0.230)。这项体外研究的结果令人鼓舞,因为对于大多数标本而言,所有残留的粘合剂都残留在牙釉质表面上。这种类型的剥离图案具有保护搪瓷表面的优点。然而,陶瓷/聚合物界面的基部断裂可能需要对脱粘策略进行修改。

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