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Simulation analysis of semiconductor manufacturing with small lot size and batch tool replacements

机译:小批量和替换批处理的半导体制造的仿真分析

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摘要

Long cycle times in semiconductor manufacturing represent an increasing challenge for the industry and lead to a growing need for breakthrough approaches to reduce it. Small lot sizes and the conversion of batch processes to mini-batch or single-wafer processes are widely regarded as a promising means for a step-wise cycle time reduction. However, there is still a lack of comprehensive and meaningful studies. In this paper, we present results of our modelling and simulation assessment. Our simulation analysis shows that small lot size and the replacement of batch tools with mini-batch or single wafer tools lead to significant reductions in cycle time but the effectiveness of lot size reduction is questionable if reduced by more than half.
机译:半导体制造中的长周期时间代表了该行业的日益严峻的挑战,并导致越来越需要减少其的突破性方法。小批量和批量处理转换为小批量或单晶圆处理被广泛认为是逐步减少周期时间的有希望的手段。但是,仍然缺乏全面而有意义的研究。在本文中,我们介绍了建模和仿真评估的结果。我们的仿真分析表明,小批量和用小批量或单晶圆工具代替批量工具可显着缩短周期时间,但如果批量减少一半以上,则批量缩减的有效性值得怀疑。

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