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首页> 外文期刊>Bulletin of Materials Science >Microstructural characterization in diffusion bonded TiC-Al_2O_3/Cr18-Ni8 joint with Ti interlayer
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Microstructural characterization in diffusion bonded TiC-Al_2O_3/Cr18-Ni8 joint with Ti interlayer

机译:Ti中间层扩散结合的TiC-Al_2O_3 / Cr18-Ni8接头的显微组织表征

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摘要

Ceramic matrix composite, TiC-Al_2O_3, and stainless steel, Crl8-Ni8, were joined at 1400 K by solid state diffusion bonding, making use of a Ti foil acting as thermal stress relief interlayer. The microstruc-ture of the joint was thus formed. The diffusion bonded TiC-Al_2O_3Cr18-Ni8 joint was investigated by a variety of characterization techniques such as scanning electron microscope (SEM) with energy dispersion spectro-scopy (EDS) and X-ray diffraction (XRD). The results indicate that Ti foil is fully fused to react with elements from substrates and Ti_3Al, TiC and alpha-Ti are formed in the diffusion bonded TiC-Al_2O_3/Crl8-Ni8 joint. The interfacial shear strength is up to 99 MPa and the shear fracture occurs close to the ceramic matrix composite due to the application of Ti foil acting as thermal stress relief interlayer.
机译:陶瓷基复合材料TiC-Al_2O_3和不锈钢Crl8-Ni8通过固态扩散结合在1400 K的温度下结合在一起,利用Ti箔作为缓解应力的中间层。这样就形成了接头的微结构。通过多种表征技术研究了扩散结合的TiC-Al_2O_3Cr18-Ni8接头,例如具有能谱分析(EDS)的扫描电子显微镜(SEM)和X射线衍射(XRD)。结果表明,Ti箔完全熔融以与基材中的元素反应,并且在扩散结合的TiC-Al_2O_3 / Crl8-Ni8接头中形成了Ti_3Al,TiC和α-Ti。界面剪切强度高达99 MPa,并且由于应用Ti箔作为热应力释放中间层,在陶瓷基复合材料附近发生剪切断裂。

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