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首页> 外文期刊>Bulletin of Materials Science >A.c. and d.c. conduction processes in octakis[(4-tert-butylbenzylthio)- porph) razinato]Cu(II) thin films with gold electrodes
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A.c. and d.c. conduction processes in octakis[(4-tert-butylbenzylthio)- porph) razinato]Cu(II) thin films with gold electrodes

机译:交流电和d.c.带有金电极的八[[4-叔丁基苄硫基)-卟啉razinato] Cu(II)薄膜的导电过程

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摘要

The d.c. and a.c. electrical transport properties of Au/Pz/Au devices with various thickness of Pz(octakis[(4-tert-butylbenzylthio)-porphyrazinato]Cu(II)) layer have been investigated. Measurements revealed that, in contrast to previously investigated Au/Pc/Au structures, low voltage d.c. behaviour of the films can be described by the field-lowering mechanisms with a log(J) ∝ V~(1/2) current density-voltage characteristics under forward and reverse bias. For high reverse voltages, the observed In(J/V~2)- I/V characteristics indicated that the origin of conduction mechanism is Fowler-Nordheim tunnelling (FNT). On the other hand, the voltage dependence of current density at the higher forward-voltage region indicates that the mechanism of conduction in Au/Pz/Au devices is space charge limited conduction dominated by exponential trap distribution. A thickness independent barrier height was observed for tunnelling, while the total trap concentration show a general tendency to decrease with increasing film thickness. The a.c. conductivity showed two regions in the ln(σ_(a.c.)) - ln(f) plots having different slopes, leading to the conclusion that for low frequency region, the dominant conduction mechanism is a small polaron tunnelling at all temperatures, whereas for high frequency region, correlated barrier hopping model is the dominant mechanism in the investigated devices.
机译:直流电和交流研究了具有不同厚度的Pz(辛基[(4-叔丁基苄硫基)-卟啉衍生物] Cu(II)层的Au / Pz / Au器件的电传输性能。测量显示,与先前研究的Au / Pc / Au结构相比,低压d.c。薄膜的行为可以通过场降低机制来描述,该机制具有正向和反向偏压下的log(J)∝ V〜(1/2)电流密度-电压特性。对于高反向电压,观察到的In(J / V〜2)-I / V特性表明,传导机制的起源是Fowler-Nordheim隧穿(FNT)。另一方面,在较高的正向电压区域,电流密度的电压依赖性表明,Au / Pz / Au器件的导电机理是受指数陷阱分布支配的空间电荷受限的导电。对于隧穿,观察到与厚度无关的势垒高度,而总陷阱浓度显示出总体趋势随着膜厚度的增加而降低。交流电导率在ln(σ_(ac))-ln(f)图中显示两个区域具有不同的斜率,从而得出结论:对于低频区域,主导的传导机制是在所有温度下的小极化子隧穿,而对于高频在相关区域,相关的障碍物跳跃模型是所研究设备的主要机制。

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