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Stress intensity factors and crack interaction in adjacent holes

机译:应力强度因子和相邻孔中的裂纹相互作用

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In this analytical investigation, stress intensity factors, K, are calculated for oblique part-elliptical through cracks nucleating and growing from an array of collinear holes subjected to remote tension, bending, and pin loading. The finite element method is used with model validation through comparisons to known stress concentration factors solutions. The three-dimensional virtual crack closure technique is used to calculate the new K solutions. This work was motivated by the need to predict fatigue crack growth in transport aircraft fuselage lap-splice skin joints. Fatigue crack growth of adjacent through cracks with oblique crack fronts can now be predicted using the results of this investigation.
机译:在此分析研究中,计算应力强度因子K,该应力强度因数是通过从受远程拉力,弯曲和销钉载荷作用的共线孔阵列中形核和生长的裂纹形成的椭圆形部分椭圆形。通过与已知应力集中因子解进行比较,有限元方法可用于模型验证。三维虚拟裂纹闭合技术用于计算新的K解。这项工作的动机是需要预测运输机机身搭接接头皮肤接头中的疲劳裂纹增长。现在可以使用这项研究的结果来预测相邻具有倾斜裂纹前沿的贯穿裂纹的疲劳裂纹扩展。

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