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首页> 外文期刊>Electrochimica Acta >A pretreatment with galvanostatic etching for copper electrodeposition on pure magnesium and magnesium alloys in an alkaline copper-sulfate bath
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A pretreatment with galvanostatic etching for copper electrodeposition on pure magnesium and magnesium alloys in an alkaline copper-sulfate bath

机译:在碱性硫酸铜浴中用恒电流蚀刻对纯镁和镁合金上的铜进行电沉积的预处理

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摘要

A pretreatment with galvanostatic etching is recommended to obtain an adherent and uniformly covered copper deposit on pure magnesium and magnesium alloy specimens (AZ31 and AZ61) in an alkaline copper-sulfate bath. The effect of galvanostatic etching on the surfaces of Mg and Mg alloy specimens can be realized by their potential variation during galvanostatic etching, in which four distinct stages could be distinguished. Galvanostatic etching to stage III, an activated surface of Mg or Mg alloy, was obtained for electroplating a uniformly covered Cu deposit in the alkaline Cu-sulfate bath. The Cu-deposited Mg or Mg alloy was used as the substrate for further Cu and then Ni electrodeposition in acid plating baths to obtain a protective Ni/Cu coating. The proposed electroplating baths are environmentally friendly, and the electrodeposition process is easy to conduct to achieve a protective coating for Mg and Mg alloys.
机译:建议使用恒电流蚀刻进行预处理,以在碱性硫酸铜浴中的纯镁和镁合金试样(AZ31和AZ61)上获得附着并均匀覆盖的铜沉积物。恒电流腐蚀对Mg和Mg合金试样表面的影响可以通过其在恒电流腐蚀过程中的电位变化来实现,其中可以区分四个不同的阶段。为了在碱性硫酸铜浴中电镀均匀覆盖的铜沉积物,获得了恒流蚀刻至阶段III(Mg或Mg合金的活化表面)的方法。将沉积有铜的Mg或Mg合金用作进一步添加Cu的基材,然后在酸性电镀液中电沉积Ni,以获得保护性的Ni / Cu涂层。所提出的电镀浴是环境友好的,并且易于进行电沉积过程以实现用于镁和镁合金的保护涂层。

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