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High-Performance Circuit Boards Based on Mesoporous Silica Filled PTFE Composite Materials

机译:基于介孔二氧化硅填充的PTFE复合材料的高性能电路板

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摘要

A series of composite materials based on a hydrophobia mesoporous silica (MCM-41-m) filled polytetrafloroethylene (PTFE) were synthesized. The composite boards prepared from the composite materials were thermally stable (T5 percent > 500 deg C). The dielectric constant D_k) and z-axis coefficient of thermal expansion (CTE_Z) were significantly decreased with increasing MCM-41-m content due to the presence of the well-dispersed hydrophobic and ordered mesoporous structure MCM-41-m particles. Ultra low Z)_k (1.70) and CTE_Z (11.8 ppm/ deg C) were obtained for the composite board containing 40 wt percent of MCM-41-m. The result indicated that the as-prepared composite materials are potentially useful as radio-frequency/microwave substrate materials.
机译:合成了一系列基于疏水介孔二氧化硅(MCM-41-m)填充的聚四氟乙烯(PTFE)的复合材料。由复合材料制成的复合板是热稳定的(T5%> 500摄氏度)。介电常数D_k)和z轴热膨胀系数(CTE_Z)随着MCM-41-m含量的增加而显着降低,这归因于疏水性良好且有序介孔结构MCM-41-m颗粒的存在。对于含有40重量%的MCM-41-m的复合板,获得了超低的Z)_k(1.70)和CTE_Z(11.8ppm /℃)。结果表明,所制备的复合材料潜在地可用作射频/微波衬底材料。

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