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Improvement in the Performance of Tin Oxide Thin-Film Transistors by Alumina Doping

机译:氧化铝掺杂改善氧化锡薄膜晶体管的性能

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Thin-film transistors (TFTs) were fabricated with an aluminum oxide-doped tin oxide (SAO) channel, deposited by cosputtering SnO2 and Al2O3 targets. The effect of the Al2O3 content on the device performance of the SnOx-based TFTs was investigated. The TFTs with a nondoped SnOx channel did not show a promising performance. However, the field-effect mobility and threshold voltage of the SAO TFTs with an Al concentration of about 0.9 atom % were improved to similar to 3.8 cm(2)/V s and similar to 0.6 V, respectively. This improved device performance was attributed to the greatly reduced carrier concentration induced by the carrier trapping at the Al impurity sites.
机译:薄膜晶体管(TFT)是通过掺铝SnO2和Al2O3靶材沉积的氧化铝掺杂的氧化锡(SAO)沟道制成的。研究了Al2O3含量对基于SnOx的TFT器件性能的影响。带有未掺杂SnOx沟道的TFT的性能并不令人满意。但是,铝浓度约为0.9%(原子)的SAO TFT的场效应迁移率和阈值电压分别提高到了3.8 cm(2)/ V s和0.6V。器件性能的提高归因于载流子在Al杂质位点处捕获而导致的载流子浓度大大降低。

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