3-D System in Package - How to Cope with Increasing Challenges

摘要

It seems that scaling of chip technology according to Moore's Law will continue for digital functionalities (logic and memory); however, increasing system integration on chip and package levels, called "More than Moore," has been observed in the past several years. This strong trend in the worldwide semiconductor industry enables more functionality, diversification, and higher value by creating smart microsystems. The latest International Technology Roadmap for Semiconductors confirms this to be a continuing trend (www.itrs.net).