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On capacity improvement of optical free space chip-to-chip interconnects

机译:关于光学自由空间芯片间互连的容量提高

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The capacity of free space optical interconnects (FSOIs) is analyzed. The interconnect capacity is expressed as a function of signal-to-noise ratio (SNR), optical transmitted power, optical received power, optical crosstalk noise power, thermal noise, and detector size and spacing. The dependence of interconnects capacity on SNR and on feature parameters of photo-detectors array (fill factor, detectors spacing) is simulated. It is shown that feature parameters of photo-detectors array can be used as design parameters to optimize and improve the interconnect capacity. The effect of increasing the power budget as far as possible to improve the interconnect capacity is investigated as well.
机译:分析了自由空间光互连(FSOI)的容量。互连能力表示为信噪比(SNR),光发射功率,光接收功率,光串扰噪声功率,热噪声以及检测器尺寸和间距的函数。模拟了互连能力对SNR和光电探测器阵列的特征参数(填充系数,探测器间距)的依赖性。结果表明,光电探测器阵列的特征参数可以作为设计参数来优化和提高互连能力。还研究了尽可能增加功率预算以提高互连能力的效果。

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