High density flexible connection

摘要

In recent years, the onset of miniaturisation and the emergence of many handheld and portable devices has led to increasing pressure on component designers to match effective design with market forces. This is particularly true where the trend towards surface mount technology has led to higher densities, therefore increasing demands on the interconnection process. One of the most common difficulties is the size and position of the LCD connection which requires high density with high reliability and long life. The existing heat seal connection process, although flexible and offering an established technology has a finite density performance and in common with other interconnection technologies sometimes provides only a partial solution to the problem.