首页> 外文期刊>ECS Journal of Solid State Science and Technology >Polarized Raman Signals from Si Wafers: Dependence of In-Plane Incident Orientation of Probing Light
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Polarized Raman Signals from Si Wafers: Dependence of In-Plane Incident Orientation of Probing Light

机译:Si晶片的偏振拉曼信号:探测光的面内入射方向的依赖性

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摘要

We report observations on polarization behavior of Raman signals from Si(100), Si(110) and Si(111) wafers depending on the orientation of in-plane probing light, in very high spectral resolution Raman measurements. Bare Si wafers were measured at the center of wafers, at 5. increments of wafer rotation, using a polychromator-based multiwavelength Raman system under 457.9, 488.0 and 514.5 nm excitation. Four-fold, two-fold and three-fold symmetrical oscillations of Raman intensity, shift and full-width-at-halfmaximum (FWHM) were observed on Si(100), Si(110) and Si(111) wafers, respectively. In Si(100), intensity and FWHM showed their maximum at < 100 > directions, while Raman shift showed its maximum at < 110 > directions. (C) The Author(s) 2015. Published by ECS. All rights reserved.
机译:我们报告在非常高的光谱分辨率拉曼测量中,根据平面探测光的方向,观察到来自Si(100),Si(110)和Si(111)晶片的拉曼信号的偏振行为。使用基于多色度仪的多波长拉曼系统,在457.9、488.0和514.5 nm激发下,在晶片中心以晶片旋转增量5.测量裸硅晶片。分别在Si(100),Si(110)和Si(111)晶片上观察到拉曼强度,位移和半峰全宽(FWHM)的四倍,两倍和三倍对称振荡。在Si(100)中,强度和FWHM在<100>方向上显示出最大值,而拉曼位移在<110>方向上显示出最大值。 (C)2015年作者。ECS发布。版权所有。

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