Observations on Supplemental Grounding and Bonding: Part 2 - Extending coverage to electronic equipment

摘要

In Part 1 of this article (July 2007), we described (per the Emerald Book and ANSI J-STD-07-A) supplemental grounding and bonding from the grounding electrode system (GES) to the telecommunications main grounding bus bar [T(M)GB]. Note: The notation "T(M)GB" indicates that the bar may be either the TMGB or TGB, depending on the location within the building. Looking forward from the T(M)GB, there's still a need for supplemental grounding and bonding between the T(M)GB and the telecommunications and information technology equipment systems, which we'll refer to in this article as ITE.