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In-plane stress analysis of cracked layers under harmonic loads

机译:谐波载荷下裂纹层的面内应力分析

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Stress analysis is carried out in an isotropic layer weakened by multiple cracks under time-harmonic loading. The viscous damping is used to model energy dissipation in the material. The analysis is based on the stress fields caused by climb and glide of an edge dislocation in the layer. The solution for dislocation is obtained by means of the integral transform method. Furthermore, stress analysis in the intact layer under self-equilibrating harmonic point loads is carried out. These solutions are employed to derive a set of Cauchy singular integral equations for analyzing cracks parallel/perpendicular to the layer boundary. The numerical solution of these equations yields dislocation densities on a crack surface which are used to determine dynamic stress intensity factors over a range of frequency. The natural frequencies of layers with horizontal cracks are obtained and the interaction of multiple cracks is studied. (C) 2015 Elsevier Ltd. All rights reserved.
机译:在时谐载荷下,在被多个裂纹削弱的各向同性层中进行应力分析。粘性阻尼用于模拟材料中的能量耗散。该分析基于层中边缘位错的爬升和滑移引起的应力场。通过积分变换方法获得位错的解。此外,在自平衡谐波点载荷下对完整层中的应力进行了分析。这些解决方案可用于导出一组Cauchy奇异积分方程,用于分析与层边界平行/垂直的裂纹。这些方程的数值解产生了裂纹表面上的位错密度,用于确定频率范围内的动态应力强度因子。获得了具有水平裂纹的层的固有频率,并研究了多个裂纹的相互作用。 (C)2015 Elsevier Ltd.保留所有权利。

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