Constitutive modeling of pressure dependent plasticity and fracture in solder joints

摘要

A new constitutive model describing the pressure dependence of plasticity and fracture in solder joints is proposed. The pressure dependence of the solders flow stress is obtained from the Peierls stress necessary to move mobile dislocations. Conservation of volume during plastic deformation is achieved through a deviatoric associated flow rule. Fracture is considered as a result of damage accumulation depending on the amount of plastic strain and triaxiality of stress the sample has experienced. The constitutive model was implemented in the FEM code Abaqus using the user subroutine UMAT. The model predictions were compared to experimental results of tensile tests performed with Sn-3.5Ag solder joints of various thicknesses. Ultimate tensile strength and ductility showed a strong dependency on the solder joints geometry. It is demonstrated that the model can nicely be fitted to experimental results.