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Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach

机译:使用铝泡沫金属散热器中的水流进行电子冷却:实验和数值方法

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Rapid developments in the design of chips and electronic devices for high-performance computers have led to a need for new and more effective methods of chip cooling. The purpose of this study was to investigate the heat transfer development and characteristics of the aluminum foam heat sink for Intel core i7 processor. The aluminum foam heat sink was subjected to a steady flow of water covering the non-Darcy flow regime (297-1353 Reynolds numbers). The bottom side of the heat sink was heated with a heat flux between 8.5 and 13.8 W/cm(2). The heat development and thermal entry length of the aluminum foam heat sink were examined and presented. The distributions of the local surface temperature and the local Nusselt number were measured and compared with the numerical data obtained using finite element method. The average Nusselt number was obtained for the range of Reynolds numbers and an empirical correlation of the average Nusselt number as a function of the Reynolds number was derived. A comparison of previous studies using water as a coolant through aluminum foam was conducted in order to calibrate the empirical correlation of the average Nusselt number. The pressure drop across the foam was measured: The thermal performance of aluminum foam heat sink was evaluated based on the average Nusselt number and the required pumping power. The experimental results revealed that the thermal entry length increases along with increases in the Reynolds number. The results also revealed that local surface temperature increases as the heat flux increases, decreasing the Reynolds number and increasing the flow direction axis. In the fully developed region, the local Nusselt number is strongly dependent on the Reynolds number. The thermal efficiency index was defined in the study in order to evaluate the thermal performance for the aluminum foam heat sink. The results were also compared with those of previous experimental studies that used air as a coolant. The results indicated that, as a coolant, water provides lower average surface temperatures and a more uniform temperature profile. The numerical results were in good agreement with the local Nusselt number and the local experimental temperature with a maximum relative error of 0.83% and 0.43%, respectively. (C) 2016 Elsevier Masson SAS. All rights reserved.
机译:用于高性能计算机的芯片和电子设备设计的快速发展导致对新的,更有效的芯片冷却方法的需求。这项研究的目的是研究英特尔酷睿i7处理器的铝泡沫散热器的传热发展和特性。使铝泡沫散热器承受覆盖非达西流动状态(297-1353雷诺数)的稳定水流。散热器的底面以8.5至13.8 W / cm(2)的热通量加热。检查并介绍了铝泡沫散热器的热量发展和热量进入长度。测量局部表面温度和局部Nusselt数的分布,并将其与使用有限元方法获得的数值数据进行比较。获得雷诺数范围内的平均努塞尔数,并得出平均努塞尔数与雷诺数的函数的经验相关性。为了校准平均努塞尔数的经验相关性,使用水作为冷却剂通过泡沫铝进行了先前研究的比较。测量了泡沫上的压降:基于平均努塞尔数和所需的泵送功率评估了泡沫铝散热器的热性能。实验结果表明,热入口长度随雷诺数的增加而增加。结果还表明,局部表面温度随着热通量的增加而增加,从而减小了雷诺数并增加了流向轴。在完全发达的地区,当地的努塞尔特数很大程度上取决于雷诺数。在研究中定义了热效率指数,以评估泡沫铝散热器的热性能。还将结果与以前使用空气作为冷却剂的实验研究进行了比较。结果表明,作为冷却剂,水提供了较低的平均表面温度和更均匀的温度曲线。数值结果与局部Nusselt数和局部实验温度高度吻合,最大相对误差分别为0.83%和0.43%。 (C)2016 Elsevier Masson SAS。版权所有。

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