Grinding Damage of BK7 using Copper-Resin Bond Coarse-Grained Diamond Wheel

摘要

Coarse-grained wheels can realize high efficient grinding of optical glass. However, the serious surface and subsurface damage will be inevitably introduced by the coarse-grained wheels. In this paper, the grinding damage of a copper-resin bond coarse-grained diamond wheel with grain size of 150μm was investigated on optical glass BK7. The wheel was first properly trued with a metal bond diamond wheel, then pre-dressing for the wheel and grinding experiments are carried out on a precision grinder assisted with electrolytic in process dressing (ELID) method. The surface roughness (Ra) of ground surface was measured using an atomic force microscope (AFM) and the surface topography were imaged by a white light interferometer (WLI) and the AFM. The subsurface damage level of ground surface was evaluated by means of both MRF spot method and taper polishing-etching method, in term of the biggest depth of subsurface damage, distribution of micro defects beneath the ground surface, the cluster depth of subsurface damage, relationship between subsurface damage (SSD) and PV surface roughness (SR), propagating distance and pattern of cracks beneath the ground surface. Experimental results indicate that a well conditioned copper-resin bond coarse-grained diamond wheel on a precision grinder can generate good surface quality of Ra less than 50nm and good subsurface integrity with SSD depth less than 3 5μm for optical glass BK7.