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首页> 外文期刊>International Journal of Material Forming: Official Journal of the European Scientific Association for Material Forming - ESAFORM >Fused filament fabrication printing process of polymers highly filled with metallic powder: a significant influence of the nozzle radiation on the substrate temperature
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Fused filament fabrication printing process of polymers highly filled with metallic powder: a significant influence of the nozzle radiation on the substrate temperature

机译:高金属粉末聚合物的熔丝制造印刷工艺:喷嘴辐射对基材温度的显着影响

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摘要

Abstract Extending fused filament fabrication process to feedstock materials used in metal injection molding could be a solution to produce the so-called green part. Nevertheless, process conditions could lead to low mechanical properties partly due to a lack of adhesion between the filament and the substrate. Thus, it is important to estimate correctly the temperature at the substrate interface induced by the filament deposition. Knowing that the extrusion printhead is a relative massive steel part moving at a small distance of the substrate, we have determined the radiative effect of nozzle passages on the temperature surface of the substrate. For that, we inserted thermocouples having a diameter of 0.25 mm under the substrate surface at a depth of 0.45 mm. Thermocouples measured an increase of temperature between 1.1 and 1.4 °C depending on the controlled nozzle and substrate temperatures. A 2D finite-difference model allows determining a significant increase of the substrate temperature at the surface varying between 3.5 and 5 °C depending on processing conditions. This increase of interface temperature, which is favorable to the adhesion of the filament to another one, can be advantageously considered.
机译:摘要 将熔丝制造工艺推广到金属注射成型中使用的原料材料中,可以成为生产所谓生坯零件的解决方案。然而,工艺条件可能导致机械性能低下,部分原因是灯丝和基材之间缺乏附着力。因此,正确估计由灯丝沉积引起的基板界面处的温度非常重要。知道挤出打印头是一个相对大的钢制部件,在基板的一小段距离上移动,我们已经确定了喷嘴通道对基板温度表面的辐射效应。为此,我们在基板表面下插入直径为0.25 mm的热电偶,深度为0.45 mm。热电偶测量到的温度升高在1.1至1.4°C之间,具体取决于受控的喷嘴和基板温度。二维有限差分模型允许根据加工条件确定表面基板温度的显着升高,变化范围在 3.5 到 5 °C 之间。可以有利地考虑界面温度的升高,这有利于灯丝与另一根灯丝的粘附。

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