Study of precision micro-holes in borosilicate glass using micro EDM combined with micro ultrasonic vibration machining

摘要

Because of its excellent anodic bonding property and surface integrity, borosilicate glass is usually used as the substrate for micro-electro mechanical systems (MEMS). For building the communication interface, micro-holes need to be drilled on this substrate. However, a micro-hole with diameter below 200 μm is difficult to manufacture using traditional machining processes. To solve this problem, a machining method that combines micro electrical-discharge machining (MEDM) and micro ultrasonic vibration machining (MUSM) is proposed herein for producing precise micro-holes with high aspect ratios in borosilicate glass. In the investigations described in this paper, a circular micro-tool was produced using the MEDM process. This tool was then used to drill a hole in glass using the MUSM process. The experiments showed that using appropriate machining parameters; the diameter variations between the entrances and exits (DVEE) could reach a value of about 2 μm in micro-holes with diameters of about 150 μm and depths of 500 μm. DVEE could be improved if an appropriate slurry concentration; ultrasonic amplitude or rotational speed was utilized. In the roundness investigations, the machining tool rotation speed had a close relationship to the degree of microhole roundness. Micro-holes with a roundness value of about 2 pm (the max. radius minus the mm. radius) could be obtained if the appropriate rotational speed was employed.