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Nanoprobing fracture length scales

机译:纳米探针断裂长度标度

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摘要

Historically fracture behavior has been measured and modeled from the largest structures of earthquakes and ships to the smallest components of semiconductor chips and magnetic recording media. Accompanying this is an evolutionary interest in scale effects partially due to advances in instrumentation and partially to expanded supercomputer simulations. We emphasize the former in this study using atomic force microscopy, nanoindentation and acoustic emission to probe volumes small in one, two and three dimensions. Predominant interest is on relatively ductile Cu and Au films and semi-brittle, silicon nanoparticles. Measured elastic and plastic properties in volumes having at least one dimension on the order of 10 - 1000nm, are shown to be state of stress and length scale dependent. These in turn are shown to affect fracture properties. All properties can vary by a factor of three dependent upon scale. Analysis of fracture behavior with dislocation-based, crack-tip shielding is shown to model both scale and stress magnitude effects.
机译:历史上已经对断裂行为进行了测量和建模,从最大的地震和船只结构到最小的半导体芯片和磁记录介质组件。随之而来的是对缩放效果的进化兴趣,部分原因是仪器的进步,部分原因是扩展的超级计算机仿真。在本研究中,我们强调前者使用原子力显微镜,纳米压痕和声发射来探测一维,二维和三维的小体积。人们最感兴趣的是相对易延展的Cu和Au薄膜以及半脆的硅纳米颗粒。所测得的至少一维尺寸在10-1000nm量级的体积中的弹性和塑性性能显示为应力状态和长度尺度相关。这些反过来表明会影响断裂性能。所有属性都可以根据比例变化三倍。显示了基于位错的裂纹尖端屏蔽对断裂行为的分析,可以模拟尺度和应力大小效应。

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