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Comparison of elastic interaction of a dislocation and a crack for four bonding conditions of the crack plane

机译:裂纹平面四种结合条件下位错与裂纹的弹性相互作用比较

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A comparison of elastic interaction of a dislocation and a crack for four bonding conditions of the crack plane was made. Four cases of single crystalline material, sliding grain boundary, perfectly bonded interface, and sliding interface were considered. The stress intensity factors arising from edge and screw dislocations and their image forces for the above four cases were compared. The stress intensity factor at a crack tip along the perfectly bonded interface arising from screw dislocation can be obtained from that in a single crystalline material if the shear modulus in the single crystalline material is replaced by the harmonic mean of both shear moduli in the bimaterial. The stress intensity factor at a crack tip along the sliding interface arising from edge dislocation in the bimaterial can be obtained from that along the sliding grain boundary in the single material if the mu/(1 - v) in the single material is substituted by the harmonic mean of mu/(1 - v) in the bimaterial where mu and v are the shear modulus and Poisson's ratio, respectively. The solutions of screw dislocation near a crack along the sliding grain boundary and sliding interface are the same as that of screw dislocation and its mirror image. Generally, the effect of edge dislocation for perfectly bonded interface on the crack propagation is mon pronounced than that for the sliding interface. The effect of edge dislocation on the crack propagation is mixed mode for the cases of perfectly bonded interface and single crystalline material, but mode I fracture for the cases of sliding interface and sliding grain boundary. All curves of F-x versus distance u from the dislocation at interface to the right-hand crack tip are similar to one another regardless of dislocation source for both sliding interface and perfectly bonded interface. The level of F-x for m = 0 is larger than that for m = -1. [References: 18]
机译:对裂纹平面的四个结合条件下的位错和裂纹的弹性相互作用进行了比较。考虑了单晶材料,滑动晶界,完美结合界面和滑动界面的四种情况。比较了上述四种情况下边缘和螺钉错位引起的应力强度因子及其像力。如果将单晶材料中的剪切模量替换为双材料中两个剪切模量的谐波均值,则可以从单晶材料中获得沿螺钉键合错位沿完美结合界面处的裂纹尖端处的应力强度因子。如果将单一材料中的mu /(1-v)替换为单一材料中的μ/(1-v),则可以从单一材料中沿滑动晶界的应力强度因子获得双材料中边缘错位引起的沿滑动界面的裂纹尖端应力强度因子。双材料中mu /(1-v)的谐波平均值,其中mu和v分别是剪切模量和泊松比。沿着滑动晶界和滑动界面的裂纹附近的螺丝位错的解决方案与螺丝位错及其镜像的解决方案相同。通常,完美结合的界面的边缘错位对裂纹扩展的影响要比滑动界面的明显。对于完美结合的界面和单晶材料,边缘错位对裂纹扩展的影响是混合模式,而对于滑动界面和滑动晶界,则是模式I断裂。从界面处的位错到右侧裂纹尖端的F-x相对于距离u的所有曲线彼此相似,而与滑动界面和完美结合界面的位错来源无关。 m = 0时F-x的水平大于m = -1时的水平。 [参考:18]

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